MWC 2021 is underway, and the first significant announcement comes from Qualcomm. The San Diego chip company revealed the Snapdragon 888 Plus chipset with a 3GHz prime CPU core and improved AI Engine, which now performs 20% much better.
Qualcomm Snapdragon 888 Plus specs:
CPU: Qualcomm Kryo 680, up to 3 GHz, 64-bit.
GPU: Adreno-660.
AI Engine: Hexagon 780, 32 TOPS.
Modem: Snapdragon X60 5G Modem-RF, 7.5 Gbps DL, 3 Gbps UL, worldwide 5G multi-SIM.
Wi-Fi: FastConnect 6900, Wi-Fi 6E, Wi-Fi 6, Wi-Fi 5, Wi-Fi 802.11/ a/b/g/ n.
Camera: Spectra 580 ISP, Triple camera as much as 28 MP, Dual video camera approximately 64 MP, Single video camera approximately 200 MP. 720p @ 960 fps, 8K @ 30 fps.
Show: 4K @ 60 Hz, QHD+ @ 144 Hz.
Process innovation: 5 nm.
Other: Bluetooth 5.2, USB 3.1.
The rest has actually stayed practically unchanged for the previous 6 months – Adreno 660 GPU, Snapdragon X60 5G modem with 7.5 Gbps leading DL speed and FastConnect 6900 that makes it possible for all the most recent Wi-Fi requirements for fast-speed download when the user does not depend on mobile data.
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The chipset is practically the like its non-Plus sibling, launched back in December with the big core being of the ARM Cortex-X1 range. The big difference is clock speed has actually been enhanced to 2.995 GHz – yes, thats the actual number.
The sixth-gen Qualcomm Hexagon 780 AI processor can now delivery 32TOPS (Tera Operations Per Second), which is improved from 26TOPS on the regular Snapdragon 888.
Agents from Asus, Motorola, Xiaomi and vivo have already validated their dedication to utilizing the brand-new Snapdragon 888 Plus chipset in their upcoming smart devices. Devices with the new platform are expected to introduce as early as Q3 2021.
