Presentation highlights successful integration of information traffic mapping to carriers.
Quectel Wireless Solutions, an international IoT options provider, showcased its middleware option for Dual SIM Service at MWC Barcelona making use of the Qualcomm ® telematics software application structure.
This framework provides access to next generation connectivity and telematics solutions based upon Qualcomm Technologies, Inc.s comprehensive know-how in 5G, C-V2X, location, telematics, automobile, functional security, hypervisors, and security.
Double SIM Service enables applications to steer information traffic using the double SIM connectivity based upon OEM choice of provider, Quality of Service (QoS), and billing. The presentation includes a Snapdragon ® Auto Modem-RF chipset from Qualcomm Technologies, with a Quectel module AG-553-EU, highlighting making use of Dual SIM Service on telematics software from Qualcomm Technologies.
” Were happy to be showing the Dual SIM service at MWC Barcelona with Qualcomm,” stated Manfred Lindacher, VP Sales Automotive International, Quectel Wireless Solutions.
” It underlines our commitment to offering worldwide automobile OEMs and Tier One providers with the most advanced connectivity choices readily available, allowing them to tackle the concerns of low connection with double sims in their applications.”
“The Dual SIM Service demonstration at MWC Barcelona showcases the close partnership we have with Quectel,” stated An Chen, Vice President, Engineering, Qualcomm Incorporated.
The Technology Value Added Services (Tech VAS) program, developed by Qualcomms Qualcomm Technology Licensing (QTL) department helps make it possible for advanced innovation options to be enhanced on Qualcomm ® hardware platforms. As part of the Tech VAS program, the Dual SIM Service function will be provided through a software application plan that will enhance car throughput, reliability, and connection.